JOINT-STOCK COMPANY «INSTITUTE OF PLASTICS NAMED AFTER PETROV G.S»

   

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JPS «Institute of Plastics» manufactures small and medium sized industrial batches of the following polymeric materials and products:

  • Modified epoxy resins present products of  modification of epoxy resins by organosilicon compounds. Modified resins are designed for the manufacture of heat-resistant adhesives, compounds, fiber glass reinforced materials and  molding powders.

  •  Epoxy compounds present compositions  based on modified epoxy resins  for  adhesives, sealants, potting compounds. They are used in electronics, electrical engineering; for the adherence of  non-polar rubbers with metals;  sealing floors in rooms with high humidity .

  • Hardeners of  epoxy resins and compositions. Assortment of amino hardeners for epoxy resins, compositions and compounds allows to vary technological properties of the uncured compositions in  a wide range, as well as to regulate the strength, dielectric and thermal properties of materials after curing.

  • The polyester  resin  are used as a binder for the manufacture of composite materials, glass fiber reinforced plastics, polymer concretes, cements, coatings and potting compounds, as well as a special usage  modifier. 

  • Phenolic  resins and varnishesare used as a polymeric base  for the manufacture of  heat-resistant adhesives ( hot and cold curing) , varnishes, as well as a component of viscoelastic compositions that are used in oil - wells during repairing and cementing operations.

  • Adhesives melt based on polyester resins are used  as a solution of resin in methylene chloride for bonding  lavsan films, lavsan with metal, wood, leather and duplicating paper, cardboard by lavsan film in the printing industry. 

  • Polysulphones are produced  in two types: polysulphone powder  for adhesives and  polysulphone in granules for heat-resistant, high strength polymeric materials with  long- term operation in the temperature range of  150-1800C. 

  • Polyimide  resins  are used as solutions of low molecular weight components in the mixture of  amide solvents with alcohols.  These resins are used as a binder for manufacture of heat-resistant  composite materials , such as fiberglass or carbon fiber reinforced plastics.  Such composite materials are capable to operate at temperatures up to 2500C (long term operation) and up to 3500C ( short term operation).

  • Polyimide  molding compounds  present a fine powder. These molding compounds are used for the manufacture of products with anti-friction and dielectric properties by the compression molding , as well as for production of heat-resistant  composite materials.

  • Aminoplast is granulated arc-resistant product  that is obtained on the basis of a melamine-formaldehyde oligomer, fillers and special additives. It is designed for the manufacture of large parts by   the compression and injection molding for electrical purposes, when improved arc- resistance, heat resistance, mechanical strength, wear resistance  are required  in a tropical environment.

  • Vibration and dampening material is a noise- and vibration-absorbing paste, that is used for coating the surface of the parts of machines, mechanisms, vehicles, etc. to reduce levels of vibration and noise generated by  them; it is also used for improving  the noise insulation of metal partitions, pipes, housings and blowers of ventilation systems, thin-walled constructions etc.,  as well as for reducing  fatigue effects in cyclically loaded constructions. 

  • Glass fiber reinforced polyamides, granulated based on PA 6 and PA 66 are designed for the manufacture of various  parts with high heat resistance and high mechanical properties by the injection molding . They can be used in electrical, structural and general application. 

  • Glass fiber reinforced polyamides, granulated based on PA 66 modified by molybdenum disulphide are designed for the manufacture of components operating at friction,  high temperatures and mechanical loads. 

  • Glass fiber reinforced polyamides, granulated based on PA 610 (assortment) are designed for the manufacture of parts with  high physical-mechanical, dielectric properties, heat resistance, wear resistance ( such as housing, board and others); for parts  with dielectric properties, improved deformation and wear-resistant properties (stops, relays, connectors, circuit board, etc.); for structural and antifriction parts (sleeves, sleeves of bearings and  et al.) used for friction assembly in  the mechanic engineering

  • Electrically conductive polypropylene  is granulated material that is obtained on the bases of the stabilized polypropylene with additives of a carbon filler and synthetic rubbers. It is designed for the manufacture of antistatic and  inter-operation packaging  for integrated circuits;  low-temperature heating elements, the collecting electrodes  of sulfuric acid electro filters and other parts with  conductive or antistatic  properties. It can be processed by the injection molding, extrusion, molding. 

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